Join the 6th annual GSA & IET International Semiconductor Forum to be held June 2-3, 2009 in Munich, Germany. The 2009 Forum is focused on leveraging and maximizing European expertise in analog/mixed-signal, wireless and MEMS applications, as well as addressing the markets for ASICs and multi-die packaging trends. The forum will feature a town hall discussion on the future of the emerging company semiconductor business model and its impact on sourcing innovation. View in depth program abstracts.

A table-top exhibition will run in parallel to the Forum, showcasing suppliers and service partners highlighting the latest technology developments.